MMTR2327P47A is an integrated electronic device that combines the functions of signal transmission (Transmit) and signal reception (Receive) in a single module. It realizes two-way data transmission in wireless or wired communication systems through high-frequency circuits, digital signal processing (DSP), radio frequency (RF) technology, etc. The output power of this transceiver module can reach 50W, and the operating frequency is 2300-2700MHz. After very rigorous testing, the spurious of this RF power amplifier is -55dBc, and the harmonic is -10dBc. There are detailed data pictures in our data sheet for your reference. This product of Mars RF uses SMA female connectors, which has the advantages of wide bandwidth, excellent performance, high reliability and long life. It is ideal for multi octave narrowband high power RF, L linear applications. The excellent performance of MMTR2327P47A makes it widely used in wireless communications, radar systems, base stations, satellite communications and other fields.

Mars RF's 100 000-level micro-assembly clean-room is designed to ensure that each of our products has excellent performance. In this high-tech production workshop, we use advanced air purification technology and strict cleanliness standards to effectively filter and remove tiny particles in the air, ensuring that the production environment of micro-assembly products is in the best state. Mars RF has its own micro-assembly technology department, which greatly guarantees the consistency of our high-frequency and high-output power products.

Micro-assembly technology is an advanced electronic assembly technology that comprehensively applies key process technologies such as high-density interconnect substrate technology, multi-chip component technology, system/subsystem assembly technology, and 3D assembly technology to assemble various micro components (integrated circuit chips and chip components) that constitute electronic circuits to form 3D structures of high-density, high-performance, high-reliability, miniature and modular circuit products. It is an important technical approach to achieve the goals of miniaturization, lightweight, high-density 3D interconnect structure, wide operating frequency band, high operating frequency and high reliability of electronic equipment.

• Narrowband & High Power;

• High Efficiency;

• Great Linearity;

• Built-In Control and Protection Circuits