EW
Radar
Test and Measurement
Communication
RF High Power Amplifier Subsystems MS60180P47A
Product introduction
RF high power amplifier subsystem MS60180P47A can perform excellently in the SHF scope, operating at a frequency of 6-18GHz, with a continuous output power of up to PSAT 50 Watts, meaning that the solid state power amplifier system MS60180P47A can achieve a gain of 47dB. RF high power amplifier subsystems MS60180P47A products of Mars RF are generally suitable for the C, X, and Ku bands, and can be applied in industries such as wireless communication, radar, satellite communication, testing and measurement. Mars RF's microwave power amplifier system MS60180P47A chassis adopts an integrated design, which can be used by plugging in. Not only can the RF high power amplifier subsystem MS60180P47A achieve such excellent high output power, but its input return loss can also reach a typical value of -10 dB, with the advantage of stable reception and output signals. If you need better values, please feel free to consult us. Mars RF has optimized the harmonic from a design perspective, resulting the RF high power amplifier subsystem MS60180P47A in an ideal harmonic value of -20 dBc , with a typical stray value of -60 dBc. The Female Type-SMA connector is applied to the RF Connectors Input/Output of the RF high power amplifier subsystem MS60180P47A. We have designed a sspa RF high power amplifier system MS60180P47A with a total of 9 needles, with 4 reserved positions designed based on functionality or the users needs. If the customer has some special requirements, we can make modifications to the original design of this RF high power amplifier subsystem.
Key Features
• Instantaneous ultra-broadband
• Suitable for CW, AM, and FM modulation type
• Compact and robust design
• Standard front panel manual gain adjust
• Unconditional stability and ruggedness
FAQ
What is a micro assembly workshop for High Power Amplifier Subsystems?
Micro assembly technology is an advanced electronic assembly technology that comprehensively applies key process technologies such as high-density interconnect substrate technology, multi-chip component technology, system/subsystem assembly technology, 3D assembly technology, etc. To assemble various micro components (integrated circuit chips and chip components) that make up electronic circuits, forming high-density, high-performance, highly reliable, micro and modular circuit products with 3D structures. An important technological approach to achieve the goals of miniaturization, lightweight, high-density 3D interconnect structure, wide operating frequency band, high operating frequency, and high reliability of electronic equipment
Mars RF's 100,000-level micro assembly clean workshop is designed to ensure that every one of our high power amplifier subsystems has excellent performance. In this high-tech production workshop, we adopt advanced air purification technology and strict cleanliness standards, which can effectively filter and remove small particles in the air, ensuring that the production environment of micro assembled products reaches the best state. Mars RF has its own micro assembly technology department, which greatly ensures the consistency of our high-frequency and high class AB RF amplifier subsystem.
May We Also Suggest
Picture
Model No.
Data Sheet
Start(MHz)
Stop(MHz)
Pout(Watts)
Gain(dB)
Voltage(V)
Mode
Size(mm)
Quote
Start:1.5
Stop:30
Pout:200
Gain:53
Size:200x150x30