The MS00810P55B is a rack-mountable unit incorporating a universal voltage power supply and a built in forced air-cooling system. This amplifier subsystem utilizes LDMOS power device that provides excellent power density, high efficiency, low distortion and wide dynamic range. Due to robust engineering

and employment of advanced broadband RF matching networks, combining techniques and qualified components, the amplifier achieves consistent performance with field proven reliability.

The main function of the power supply chassis is to convert the 110V-220V AC voltage into 28V DC voltage for the SSPA module, 24V DC voltage for the fan assembly and 5V DC voltage for the control box. DC28V and DC24V/5V interfaces are located on the rear panel of the power supply chassis and the power amplifier chassis. The power amplifier chassis mainly includes the SSPA modules, power divider, coupler, detector, control box, LCD display and fan assembly. MS00810P55B low frequency amplifier can cover 250 watt amp and 200 watt amplifier. As a saturated amplifier, it's your best choice.

√ 300 watta CW 

√ 80MHz-1000MHz (0.08-1GHz)

√ High Efficiency 

√ AB class

√ Over-temperature protection

√ Suitable for CW, AM, and FM modulation type  

√ Compact and robust design 

√ Unconditional stability and ruggedness 

Mars RF has its own micro-assembly technology department, which greatly ensures the consistency of our high-frequency and high-output power products.

Micro-assembly technology is the comprehensive application of key process technologies such as high-density interconnection substrate technology, multi-chip component technology, system/subsystem assembly technology, and 3D assembly technology to integrate various micro-components (integrated circuit chips and chips) that constitute electronic circuits. Components) are assembled to form an advanced electronic assembly technology for high-density, high-performance, high-reliability, micro-miniature and modular circuit products with a 3D structure. An important technical approach to achieve the goals of miniaturization, lightweight, high-density 3D interconnection structure, wide operating frequency band, high operating frequency and high reliability of electronic equipment.

1.Can I use my own logo/part number on the products?

We use laser engraving and can engrave customers' logos for free. If you don’t need the logo, we can print the connector definition content only.

2.Will the product have Chinese characters inside?

Mars RF is open to all overseas customers. There will be no Chinese logos on the outside or inside of our products. We focus on customer experience and strive to become your most trusted power amplifier manufacturer.